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Packaging of active devices using plastic injection moulding

 
: Seffner, L.; Moritz, T.; Schönecker, A.J.; Roscher, H.-J.; Anselment, C.; Just, D.J.

Borgmann, H. ; Wirtschaftsförderung Bremen GmbH -WFB-; Hanseatische Veranstaltungs GmbH -HVG-, Geschäftsbereich Messe Bremen, Bremen:
ACTUATOR 2010, 12th International Conference on New Actuators & 6th International Exhibition on Smart Actuators and Drive Systems. Conference Proceedings : 14. - 16. Juni 2010, Bremen, Germany
Bremen: WFB, 2010
ISBN: 978-3-933339-13-3
ISBN: 978-3-933339-12-6
S.620-623
International Conference on New Actuators (ACTUATOR) <12, 2010, Bremen>
International Exhibition on Smart Actuators and Drive Systems <6, 2010, Bremen>
Englisch
Konferenzbeitrag
Fraunhofer IWU ()
Fraunhofer IKTS ()
piezoelectric actuator; plastic injection moulding; active compound device

Abstract
The concept of adaptronic systems proved to be a successful approach on laboratory scale worldwide, but up to now no large-scale, commercial applications were launched at the market. There is an essential need for series production methods, to preassemble the manifold of individual parts building an active compound device. Benefits are expected by reducing the expenditures for assembly, higher robustness against mechanical stress or environmental factors and thus prevention of damage during system production. This paper describes the process chain for manufacturing a complex compound device using plastic injection moulding as a series technology. Such compounds offer new application areas for example in automotive production or as power actuators for micro technology, handling and actuator systems.

: http://publica.fraunhofer.de/dokumente/N-134109.html