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Lead-free flip-chip solder interconnects - materials mechanics and reliability issues
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2001
Conference Paper
Titel
Lead-free flip-chip solder interconnects - materials mechanics and reliability issues
Author(s)
Schubert, A.
Dudek, R.
Walter, H.
Jung, E.
Gollhardt, A.
Michel, B.
Hauptwerk
Mechanical reliability simulation characterisation testing
Konferenz
Workshop Micro Materials Testing and Simulation 2001
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM