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Delamination and combined compound cracking of EMC-copper interfaces

: Xiao, A.; Schlottig, G.; Pape, H.; Wunderle, B.; Jansen, K.M.B.; Ernst, L.J.


IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Industries Alliance -EIA-:
60th Electronic Components and Technology Conference, ECTC 2010. Proceedings. Part 1 : 1-4 June 2010, Las Vegas, NV, USA
New York, NY: IEEE, 2010
ISBN: 978-1-4244-6411-1
ISBN: 978-1-4244-6410-4
Electronic Components and Technology Conference (ECTC) <60, 2010, Las Vegas/Nev.>
Fraunhofer IZM ()

The present study deals with experimental investigation of the delamination toughness of EMC (epoxy molding compound) and Copper-leadframe interfaces. Test samples were directly obtained from the production line. EMC is attached on copper substrates with various surface treatments. Mixed mode bending experiments were performed under various temperature and moisture environments. The test procedure and some results were reported previously in ECTC08 and ECTC09 [1–2]. Recently, we studied the effect of delaminated surfaces in order to get better understanding of the established fracture toughness. Therefore, after the delamination experiments, some of the delaminated samples were subjected to various surface analyses (SEM, FIB, EDX). Two types of failure patterns are found depending on the loading mode mixture, and the environmental conditions. Firstly, depending on the type of copper surface treatment, pure interface delamination is observed for some of the interfaces. Here, we observed clean delaminated copper surfaces. The second type of failure is a combination of interface delamination and compound cracking. Here, it is found that after the separation of interfaces, some EMC remains on the copper surface. In this case the experiment results showed that the interface delamination and molding compound cracking combined failure occurs at relatively high force values.