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1996
Conference Paper
Titel
Full-duplex transceiver-PIC fabricated by using three MOVPE growth steps
Abstract
Summary form only given. For future photonic communications systems low-cost optoelectronic-integrated circuits are indispensable. These photonic ICs should have an ultrahigh capacity and should offer a maximum of flexibility in device architecture. High performance and high reliability are a must for the economic implementation. Based on our experiences in the fabrication of a polarization diversity heterodyne receiver we present here an improved, cost-effective, and versatile integration PIC process with reduced epitaxial growth steps.
Tags
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demodulation
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integrated optoelectronics
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optical fabrication
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optical receivers
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semiconductor growth
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transceivers
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vapour phase epitaxial growth
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full-duplex transceiver-pic fabrication
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movpe growth steps
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photonic communications systems
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low-cost optoelectronic-integrated circuits
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photonic ics
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ultrahigh capacity
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device architecture
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high reliability
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economic implementation
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polarization diversity heterodyne receiver
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cost-effective
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versatile integration pic process
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reduced epitaxial growth steps