PublicaHier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
Precision photonic packaging using laser-based solderjet bumping
Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM : Como, Italy, 23 - 24 March 2010
Berlin: VDE-Verlag, 2010
|European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <4, 2010, Como>|
|Fraunhofer IOF ()|
| solderjet bumping; laser based soldering; flux-free soldering; micro assembly; heterogenous system integration|
Laser-based Solderjet Bumping is a fast, precise and versatile technique for flux-free soldering of hybrid photonic systems and features a high potential for automation. Liquid solder droplets are jetted to the wetting surfaces of 3D joining geometries. A direct coupling high power fibre assembly with an adjusted multi-mode step-index fibre in front of an IR-laser diode is shown. The fibre is fixated within a solder droplet with a verticle gap of up to 50 µm and placement accuracy of 3 µm.