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Packaging of OEICs with tapered fibers for optical communications systems with up to 45 GHz modulation bandwidth


Faulkner, D.W.:
European Conference on Networks and Optical Communications 1999 (NOC '99). Proceedings. Vol.1: Broadband access and technology
Amsterdam: IOS Press, 1999
ISBN: 90-5199-496-6
ISBN: 4-274-90296-X
ISBN: 3-905084-59-7
European Conference on Networks and Optical Communications (NOC) <1999, Delft>
Fraunhofer HHI ()
electro-optical modulation; gallium arsenide; indium compounds; integrated optoelectronics; module; optical couplers; optical fibre communication; optical receiver; optical transmitter; packaging; semiconductor optical amplifier; tapered fiber; optical communication systems; fibre-chip coupling; waveguide-fed oeic; InP; GaAs; diode laser; semiconductor amplifiers; optical modulator; simultaneous coupling; electrical modulation; rf connectors; long-term stability; -10 to 50 degc

We designed and fabricated a series of modules for one-sided and double-sided fiber-chip coupling of waveguide-fed InP and GaAs OEIC such as diode lasers, semiconductor amplifiers and optical modulators. Simultaneous coupling of both chip sides to the fiber is possible with a new patented set-up. The modules are temperature-controlled within an ambient temperature range from -10 degrees C to +50 degrees C and electrical modulation signals up to 45 GHz can be fed via RF connectors to the OEIC. The coupling loss is typically less then 3 dB with tapered fibers. The package shows good long-term stability and is well-suited for prototypes and small-scale production.