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New reconfigurable fiber-chip coupling method for multipurpose packaging with up to 50 GHz modulation bandwidth

: Fischer, U.H.P.; Peters, K.; Ziegler, R.; Pech, D.; Kilk, A.; Eckhardt, T.; Mekonnen, G.G.; Jacumeit, G.


Optical Fiber Technology 6 (2000), Nr.1, S.68-73
ISSN: 1068-5200
Fraunhofer HHI ()
chip scale packaging; electro-optical modulation; integrated optoelectronics; modules; optical fibre couplers; semiconductor optical amplifiers; reconfigurable fiber-chip coupling method; multipurpose packaging; GHz modulation bandwidth; one-sided fiber-chip coupling; double-sided fiber-chip coupling; waveguide-fed inp; GaAs oeics; diode lasers; semiconductor amplifiers; optical modulators; temperature controlled; ambient temperature range; electrical modulation signals; oeic; coupling loss; tapered fibers; long-term stability; small-scale production; -10 to 50 c; 3 db; inp; GaAs

We designed and fabricated a series of modules for one-sided and double-sided fiber-chip coupling of waveguide-fed InP and GaAs OEICs such as diode lasers, semiconductor amplifiers, and optical modulators. Simultaneous coupling of both chip sides to the fiber is possible with a new patented set-up. The modules are temperature controlled within an ambient temperature range from -10 to +50 degrees C and electrical modulation signals up to 45 GHz can be fed via RF connectors to the OEIC. The coupling loss is typically less than 3 dB with tapered fibers. The package shows good long-term stability and is well suited for prototypes and small-scale production.