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2000
Journal Article
Titel
New reconfigurable fiber-chip coupling method for multipurpose packaging with up to 50 GHz modulation bandwidth
Abstract
We designed and fabricated a series of modules for one-sided and double-sided fiber-chip coupling of waveguide-fed InP and GaAs OEICs such as diode lasers, semiconductor amplifiers, and optical modulators. Simultaneous coupling of both chip sides to the fiber is possible with a new patented set-up. The modules are temperature controlled within an ambient temperature range from -10 to +50 degrees C and electrical modulation signals up to 45 GHz can be fed via RF connectors to the OEIC. The coupling loss is typically less than 3 dB with tapered fibers. The package shows good long-term stability and is well suited for prototypes and small-scale production.
Tags
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chip scale packaging
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electro-optical modulation
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integrated optoelectronics
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modules
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optical fibre couplers
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semiconductor optical amplifiers
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reconfigurable fiber-chip coupling method
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multipurpose packaging
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GHz modulation bandwidth
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one-sided fiber-chip coupling
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double-sided fiber-chip coupling
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waveguide-fed inp
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GaAs oeics
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diode lasers
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semiconductor amplifiers
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optical modulators
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temperature controlled
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ambient temperature range
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electrical modulation signals
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oeic
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coupling loss
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tapered fibers
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long-term stability
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small-scale production
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-10 to 50 c
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3 db
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inp
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GaAs