Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

A new fiber-chip coupling concept for reusable multipurpose packaging suitable for up to 45 GHz bandwidth

 

Societe des Electriciens et des Electroniciens -SEE-:
25th European Conference on Optical Communication, ECOC '99, conference and exhibition. Vol.1:Regular and invited papers : September 26 - 30, 1999, Nice, France, at the Nice Acropolis Convention Center
Paris: SEE, 1999
ISBN: 2-912328-12-8
S.336-337
European Conference on Optical Communication (ECOC) <25, 1999, Nice>
Englisch
Konferenzbeitrag
Fraunhofer HHI ()
chip scale packaging; iii-v semiconductors; indium compounds; integrated optoelectronics; modules; optical communication equipment; optical fibre couplers; fiber-chip coupling concept; reusable multipurpose; GHz bandwidth; InP-based oeics; small-scale production; chip sides; patented set-up; 45 GHz; inp

Abstract
We designed a series of modules for fiber-chip coupling of InP-based OEICs, which are well suited for small-scale production. Simultaneous coupling of both chip sides to fibers is possible with a new patented set-up.

: http://publica.fraunhofer.de/dokumente/N-12977.html