Options
2000
Conference Paper
Titel
Flexible, reliable and simple fabrication of integrated spot size converters with shifting mask technique
Abstract
The fabrication of integrated spot size converters employing standard contact photolithography in a novel way and dry etching technique is presented. During the exposure the mask is shifted parallel to the substrates surface. Exploiting the graduation properties the resist is not completely dissolved, so that a vertical structure remains with a profile that can easily be predetermined. The resist pattern is subsequently transferred into the semiconductor by means of ion beam etching. The technique has proven to be flexible, reliable and simple. The optical measurements of the fabricated spot size converters show that the loss of fibre-chip coupling is considerably reduced and the alignment tolerances are improved.