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Fiber-chip-coupling modules with up to 50 GHz modulation bandwidth and reusable fiber-chip-coupling mechanism

: Eckhardt, T.; Krips, O.; Fischer, U.H.P.

	Verband der Elektrotechnik, Elektronik, Informationstechnik -VDE-: MICRO.tec 2000. VDE World Microtechnologies Congress: Applications - Trends - Visions. Proceedings. Vol.1 : VDE World Microtechnologies Congress, September 25 - 27, 2000, Expo 2000, Hannover, Germany Berlin: VDE-Verlag, 2000 ISBN: 3-8007-2579-7 S.95-99
	World Microtechnologies Congress (MICROTEC) <2000, Hannover>

	Englisch
	Konferenzbeitrag
	Fraunhofer HHI ()
	integrated optoelectronics; modules; optical fibre couplers; optical modulation; temperature control; thermal stability; fiber-chip-coupling modules; modulation bandwidth; reusable fiber-chip-coupling mechanism; dil modules; small-scale production; rapid prototyping; waveguide-fed InP oeics; waveguide-fed GaAs oeics; optical modulators; tapered single mode fibers; temperature controlled modules; rf connectors; 15 to 40 c; 50 GHz; InP; GaAs

Abstract
We designed and fabricated DIL-modules with a reusable optical coupling set-up, which is well suited for small-scale production and rapid prototyping of waveguide-fed InP and GaAs OEICs like diode lasers, semiconductor amplifiers and optical modulators. The light output of these OEICs is collected with high efficiency into tapered single mode fibers with a patented set-up. The modules are temperature controlled within an ambient range from 15 degrees C to 40 degrees C and electrical modulation signals up to 50 GHz can be fed via RF connectors to the OEIC.

: http://publica.fraunhofer.de/dokumente/N-12909.html