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Recrystallization of the copper bottom electrode during complex oxide deposition onto kapton films

 
: Suchaneck, G.; Hubicka, Z.; Levin, A.A.; Günther, S.; Cada, M.; Dejneka, A.; Jastrabik, L.; Meyer, D.C.; Schultheiss, E.; Gerlach, G.

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Institute of Electrical and Electronics Engineers -IEEE-:
ISAF 2009, 18th IEEE International Symposium on the Applications of Ferroelectrics : 23-27 Aug. 2009, Xian
New York, NY: IEEE, 2009
ISBN: 978-1-4244-4970-5
5 S.
International Symposium on the Applications of Ferroelectrics (ISAF) <18, 2009, Xian>
Englisch
Konferenzbeitrag
Fraunhofer FEP ()

Abstract
In this work, we investigate for the first time the influence of complex oxide film deposition onto copper-coated polymer foils comprising a TiN seed layer on the microstructure of the underlaying randomly oriented copper film by means of wide-angle X-ray diffraction. Evidence of Cu crystallite size growth is given which is accompanied by an increase of Cu scattering crystalline volume. The final size of the copper crystallites depends on composition and microstructure of the ceramic oxide film.

: http://publica.fraunhofer.de/dokumente/N-129023.html