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40 GHz InP-based photoreceiver OEICs: Application for 40 Gb/s TDM systems and beyond

: Bach, H.G.; Schlaak, W.; Mekonnen, G.G.; Umbach, A.; Schramm, C.; Unterborsch, G.; Passenberg, W.

Optical Society of America -OSA-, Washington/D.C.; IEEE Lasers and Electro-Optics Society:
Integrated Photonics Research 2000. Postconference edition : July 12 - 15, 2000, Québec Hilton Hotel, Québec, Canada
Washington, DC: OSA, 2000 (OSA trends in optics and photonic series 45)
ISBN: 1-557-52644-3
Conference "Integrated Photonics Research" <2000, Quebec>
Fraunhofer HHI ()
HEMT integrated circuits; iii-v semiconductors; indium compounds; integrated circuit packaging; integrated optoelectronics; mmic amplifiers; optical receivers; photodiodes; time division multiplexing; travelling wave amplifiers; InP-based photoreceiver oeics; 40 gb/s tdm systems; side-illuminated photodiodes; amplifiers; traveling wave concept; packaged oeics; pig-tailed modules; waveguide-integrated photodiode; HEMT-based amplifier; photoreceiver oeics; traveling wave amplifiers; 40 GHz; 40 Gbit/s; 1.55 micron; GaInAsP-InP

Progress of 40 Gb/s photoreceiver OEICs for 1.55 mu m TDM systems is described. The OEICs comprise side-illuminated photodiodes and amplifiers, based on the traveling wave concept. Results from packaged OEICs into pig-tailed modules are given.