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Piezoelectric composite materials and structures

Piezoelektrische Verbundwerkstoffe und Strukturen
: Schönecker, A.

Priya, S. ; American Ceramic Society -ACerS-, Westerville/Ohio:
Advances in electronic ceramics II. A collection of papers presented at the 33rd International Conference on Advanced Ceramics and Composite 2009 : January 18 - 23, 2009, Daytona Beach, Florida; of the three symposia listed below: Symposium 6 Key Materials and Technologies for Efficient Direct Thermal-to-Electrical Conversion, symposium 11, Symposium on Advanced Dielectrics, Piezoelectric, Ferroelectric, and Multiferroic Materials, Focussed Session 2 Materials for Solid State Lighting
Hoboken/NJ: Wiley, 2010 (Ceramic engineering & science proceedings 30, 9)
ISBN: 978-0-470-45759-7
ISBN: 0-470-45759-7
ISSN: 0196-6219
International Conference on Advanced Ceramics and Composites <33, 2009, Daytona Beach/Fla.>
Symposium on Advanced Dielectrics, Piezoelectric, Ferroelectric, and Multiferroic Materials <2009, Daytona Beach/Fla.>
Fraunhofer IKTS ()
piezoelectric composite material; piezoceramic technology; smart device; energy consumption; piezoelectric ceramic

* Introduction
* Key Ceramic Technologies
* Modules by Microsystems Technology
* Adaptive Structures
* Conclusions
* Acknowledgement
The present paper considers the correlations between and advanced piezoceramic technologies and the development of smart devices, microsystems and structures. Bob Newnham proposed the idea of smart materials in the 70 ties. Since that we find research programs focused on systems with embedded actuators, sensors and controller units. Active structures proved beneficial, which for example arises from increased saftey, reduced energy consumption, extended life cycle and unique performance. But as a non-series product they failed often by high production costs. In other words, extension of market share to active structures by commercial applications requires technology chains and designs, which are compatible with mass production. An effective approach to overcome this obstacle might be the use of microsystems / MEMS technology as intermediate step providing pre-integration of active functions.
Technological developments of the recent past following the here expressed strategy are summarized in the paper. We tried to bridge the gap between piezoceramic transducer and smart structure fabrication by qualification and adjustment of high efficient production methods of piezoceramic transducers (extrusion spinning, molding and screen printing), electronic circuits (electronics packaging and electronics production) and structural components (metal die casting). Examples will be given related to integrated thick films in silicon technology, and to ceramic multilayer, polymer and metal matrix architectures.