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Sensitivity Analysis of Technological Fabrication Tolerances on the Lifetime of Flip-Chip Solder Joints

 
: Eckert, T.; Kornelius, T.; Bochow-Ness, O.; Müller, W.H.; Reichl, H.

:

Institute of Electrical and Electronics Engineers -IEEE-:
10th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009 : Delft, Netherlands, 26 - 29 April 2009
New York, NY: IEEE, 2009
ISBN: 978-1-4244-4160-0
ISBN: 978-1-4244-4159-4
S.274-280
International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <10, 2009, Delft>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
In this paper we discuss the influence of solder joint geometry on the lifetime of a flip chip assembly. Geometry variations caused by variations of solder volume, pad configuration, and pad size on the Printed Circuit Board (PCB) were taken into account. Typically these parameters vary due to technological fabrication tolerances. Consequently, the influence of such design aspects on system reliability was studied in detail by using Finite Element Analysis (FEA) models. Selected solder joint geometry variations were assembled and tested in a thermal cycling chamber. Simulation and experimental results were compared and some advice is given regarding their evaluation.

: http://publica.fraunhofer.de/dokumente/N-122340.html