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Integrated Thermo-Electro-Mechanical Modeling of 3D e-Cubes Structures

 
: Janczyk, G.; Bieniek, T.; Janus, P.; Kociubinski, A.; Grabiec, P.; Szynka, J.; Reitz, M.S.; Schneider, P.; Kaulfersch, E.

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Napieralski, A. ; Technical University of Lodz, Department of Microelectronics and Computer Science; Warsaw University of Technology, Institute of Microelectronics and Optoelectronics; Institute of Electrical and Electronics Engineers -IEEE-, Poland Section:
Mixed Design of Integrated Circuits and Systems, MIXDES 2007 : Proceedings of the 14th International Conference, Ciechocinek, Poland, 21-23 June, 2007
Lodz, 2007
ISBN: 83-922632-4-3
ISBN: 9788392263241
S.297-300
International Conference Mixed Design of Integrated Circuits and Systems (MIXDES) <14, 2007, Ciechocinek>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
The complex silicon systems formed by the several specialized devices like SOC, RF devices, power devices, MEMS wafers are fabricated in dedicated technologies. If the designer attempts to integrate them into the one big multifunctional system, he meets the new, yet unexplored fields for the multidisciplinary, mutually dependent thermal, electrical, EM and mechanical parameters modeling. This article attempts to clarify, and presents how to simplify this problem.

: http://publica.fraunhofer.de/dokumente/N-120519.html