PublicaHier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
Simulation of Interface Cracks in Microelectronic Packaging
Fracture of Nano and Engineering Materials and Structures. Book + CD-ROM : Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006
Dordrecht: Springer Netherland, 2006
ISBN: 978-1-402-04971-2 (print)
|European Conference on Fracture (ECF) <16, 2006, Alexandroupolis>|
|Fraunhofer IZM ()|
Increasing use under harsh environmental conditions - extreme temperatures, in particular often lead to fatigue and failure of advanced electronic packages and related systems. As a result, its thermo-mechanical reliability becomes more and more one of the most important preconditions for adopting it in industrial applications.