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Through-Silicon Via Technologies for Extreme Miniaturized 3D Integrated Wireless Sensor Systems (e-CUBES)

 
: Ramm, P.; Klumpp, A.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Electron Devices Society:
IEEE International Interconnect Technology Conference, IITC 2008. Proceedings : Hyatt Regency Hotel, Burlingame, CA, June 2 - 4, 2008
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-1911-1 (Print)
S.7-9
International Interconnect Technology Conference (IITC) <2008, Burlingame/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
Fraunhofer IZM introduced a 3-D integration process, the so-called ICV-SLID technology based on inter-chip vias through the device substrates (through silicon vias) and metal bonding using solid-liquid-interdiffusion (SLID) soldering for simultaneous mechanical and the electrical connection [1]. The ICV-SLID technology is optimized for 3D integration of e-CUBES processing units, while interconnection techniques by hollow vias and Au stud bumps are used for stacking of sensor devices to the 3D-IC.

: http://publica.fraunhofer.de/dokumente/N-120443.html