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Fabrication Challenges of 3D Integration Technologies for More Than Moore Applications
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2008
Conference Paper
Titel
Fabrication Challenges of 3D Integration Technologies for More Than Moore Applications
Author(s)
Ramm, P.
Taklo, M.M.V.
Hauptwerk
Twenty Fifth International VLSI Multilevel Inerconnection Conference (VMIC) 2008. Proceedings
Konferenz
International VLSI Multilevel Interconnection Conference (VMIC) 2008
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM