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Fabrication Challenges of 3D Integration Technologies for More Than Moore Applications

 
: Ramm, P.; Taklo, M.M.V.

Institute for Microelectronics InterConnection -IMIC-, Tampa, Fla.:
Twenty Fifth International VLSI Multilevel Inerconnection Conference (VMIC) 2008. Proceedings : October 28 - 30, 2008, Fremont Marriott Hotel, Fremont, California
Fremont, Calif., 2008
International VLSI Multilevel Interconnection Conference (VMIC) <25, 2008, Fremont/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/N-120442.html