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Flex Technology for Foldable Medical Flip Chip Devices

 
: Pahl, B.; Löher, T.; Burkhard, H.; Link, J.; Aschenbrenner, R.

International Microelectronics and Packaging Society -IMAPS-:
International Conference and Exhibition on Device Packaging 2008. Exhibitor presentations, technical presentations and extended abstracts. CD-ROM : March 17 - 20, 2008, Scottsdale, Arizona
2008
6 S.
IMAPS Device Packaging Conference <2008, Scotdale>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/N-120431.html