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Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders

 
: Déplanque, S.; Nüchter, W.; Spraul, M.; Wunderle, B.; Dudek, R.; Michel, B.

:

Ernst, L.J. ; IEEE Components, Packaging, and Manufacturing Technology Society:
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems, EuroSimE 2005 : Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, April 18, 19, 20, 2005, Radisson Hotel, Berlin, Germany
Piscataway, NJ: IEEE Order Department, 2005
ISBN: 0-7803-9062-8
ISBN: 0-7803-9063-6
S.71-78
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) <6, 2005, Berlin>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/N-120394.html