Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Package Induced Stress Simulation and Experimental Verification

 
: Schindler-Saefkow, F.; Wittler, O.; Schreier-Alt, T.; Kittel, H.; Michel, B.

Gessner, T. ; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart systems integration 2008 : 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components, Barcelona, Spain, 9 - 10, April 2008
Berlin: VDE-Verlag, 2008
ISBN: 978-3-8007-3081-0
ISBN: 3-8007-3081-2
S.521-524
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components <2, 2008, Barcelona>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
During and after packaging mechanical stresses and deformations can be imposed on the active MEMS structures, which can have a large impact on the device performance, operating range and reliability [1]. This effect can for example be assessed by coupled package and device modelling [2,3]. To be able to assess this impact for molded sensors, parametric package models have been set-up, which can describe and quantify the mechanical stresses occurring during molding, temperature change and long term operation. Stresses, which build up after molding of a device (i.e. after post-mold cure), are sensitive with regard to the properties of the packaging materials (i.e. CTE, Young's Modulus, glass transition temperature). For a reliable design, the question arises, which property has the largest impact and how the mechanical stresses can be reduced.

: http://publica.fraunhofer.de/dokumente/N-120388.html