Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Optimization of Electronics Assemblies towards Robust Design under Fracture, Delamination and Fatigue Aspects
| Keyun, B. ; China Electronic Packaging Society; Institute of Electrical and Electronics Engineers -IEEE-:
8th International Conference on Electronics Packaging Technology, ICEPT 2007 : Shanghai, China, August 14th - 17th, 2007
Piscataway, NJ: IEEE Operations Center, 2007
ISBN: 1-424-41391-5
ISBN: 978-1-424-41391-1
ISBN: 1-4244-1392-3
S.97-104 |
| International Conference on Electronics Packaging Technology (ICEPT) <8, 2007, Shanghai> |
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| Englisch |
| Konferenzbeitrag |
| Fraunhofer ENAS ()
Fraunhofer IZM () |