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Mechanical Characterisation of Thin Metal Layers by Modelling of the Nanoindentation Experiment

: Wittler, O.; Mroßko, R.; Kaulfersch, E.; Wunderle, B.; Michel, B.


Institute of Electrical and Electronics Engineers -IEEE-:
2nd Electronics Systemintegration Technology Conference, ESTC 2008. Proceedings. Vol.2 : 1st - 4th September 2008, Greenwich, London, UK
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2813-7
ISBN: 978-1-4244-2814-4
ISBN: 1-4244-2813-0
Electronics Systemintegration Technology Conference (ESTC) <2, 2008, London>
Fraunhofer ENAS ()
Fraunhofer IZM ()

Obtaining material data for thin metal layers is a mayor issue in the reliability assessment of microelectronic products. Therefore a method for obtaining elastic-plastic material data is analyzed and discussed in this paper. It is based on the nanoindentation of a film on a silicon substrate and the modeling of it. Thus it becomes possible to fit specific material models to the indentation experiment. Results are shown for two AlSiCu layers.