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Applied encapsulation methods in mechatronics

: Rebholz, C.; Badstübner, K.; Ansorge, F.; Reichl, H.

Reichl, H. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies 2005 : Micro Electro, Opto, Mechanical Systems & Components International Conference & Exhibition, October 5-6, 2005, Munich, Germany
Poing: Franzis, 2005
ISBN: 3-7723-7040-3
International Conference on Micro Electro, Opto, Mechanical Systems & Components <2005, München>
Fraunhofer IZM ()

The housing of mechatronic components has to fulfill different tasks: the protection from enviromental and mechanical stress, integrated mechanical and thermal functions (e.g. connector, heat sink), integrated electrical function (e.g. MID) and a pleasing design. Different encapsulation methods, used at the MMZ-Oberpfaffenhofen for the encapsulation of mechatronic systems, will be shown and described. Both thermoplastic and duroplastic packaging processes will be described. By thermoplastic packaging the injection molding process and the hotmelt process will be specified. By duroplastic packaging the transfer molding process and an extra method of liquid encapsulation for non-planar surfaces / volumes will be shown. In particular for injection molding the MTTCs (Mechatronic Thermoplastic Circuit Carriers) will be regarded by demonstrators which were manufactured at the MMZ-Oberpfaffenhofen. MTTCs are injection molded thermoplastic parts with integrated circuit traces. By the 3-dimensional combination of mechanical and electronic elements , this technology offers a huge potential in design and functionality. Because of the geometric adaption of the circuit carrier and the increasing miniaturization, it is possible to assemble smallest, reliable and cost-efficient systems. Also an overview above available thermoplastic materials for MTTCs which are appropriate for the LDS-process (Laser Direct Structuring) will be given. As an example for duroplastic encapsulation of mechatronic systems, a method of liquid encapsulation for non-planar volumes will be demonstrated at an ?intelligent bearing? in which sensors and electronic devices are integrated in an industrial bearing.