Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Modular 3D Packages in PCB Technology

: Schindler-Saefkow, F.; Amiri Jam, K.; Hillmann, V.; Großer, V.

Michel, B.; Aschenbrenner, R.:
The world of electronic packaging and system integration : Anniversary edition 60th birthday of Herbert Reichl
Dresden: ddp Goldenbogen, 2004
ISBN: 3-932434-76-5
ISBN: 978-3-932434-76-1
Aufsatz in Buch
Fraunhofer IZM ()

The importance of 3D packages with standardized interfaces has increased continually over the past years. 3D packaging allows to create new microelectronic devices and micro system in dependence on the real geometries inside- the end product. Furthermore by means of 3D packaging a very high integration rate can be obtained. Based on these advantages several kinds of 3D packaging methods were developed at all levels of microelectronic packaging (for example at the chip level - VSI (Vertical System Integration)). In this paper the 3D packaging methods based on PCB and LTCC will be described. A special type of 3D packaging with well defined interfaces between the stacked modules is Match-X.