English
Deutsch
Log In
Password Login
or
Log in with Fraunhofer Smartcard
Research Outputs
Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Artikel
FE-analysis of leaded and lead-free solder joints under thermal fatigue loading
Details
Full
Export
Statistics
Options
2004
Book Article
Titel
FE-analysis of leaded and lead-free solder joints under thermal fatigue loading
Author(s)
Dudek, R.
Walter, H.
Döring, R.
Michel, B.
Hauptwerk
The world of electronic packaging and system integration
Language
English
google-scholar
View Details
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM