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Novel Microstructuring Technology for Glass on Silicon and Glass - Substrates

: Töpper, M.; Mund, D.; Leib, J.

IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Industries Alliance -EIA-; Electronic Components, Assemblies, and Materials Association:
54th Electronic Components & Technology Conference 2004. Proceedings. Vol.1 : Las Vegas, Nevada, USA, June 1 - 4, 2004
Piscataway, NJ: IEEE Service Center, 2004
ISBN: 0-7803-8365-6
ISBN: 0-7803-8366-4
Electronic Components and Technology Conference (ECTC) <54, 2004, Las Vegas/Nev.>
Fraunhofer IZM ()

Micro structuring glass (MSG) technology is an exciting new technology, that has the potential for solving demands in microelectronic and microfluidic applications including hermetic wafer level packaging. MSG offers the following advantages; chemical resistant borosilicate glass layers, layered structuring with photo resist and high glass deposition rates at low temperatures.