Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Capabilities of Incorporating Bulk Fracture, Bimaterial Interface Fracture and Fatigue Evaluation into RSM/DOE Concepts of Enhanced Microelectronics Applications
| Keyun, B. ; Institute of Electrical and Electronics Engineers -IEEE-; China Electronic Packaging Society:
7th International Conference on Electronics Packaging Technology 2006 : Shanghai, China, August 26 to 29, 2006
Piscataway, NJ: IEEE Operations Center, 2006
ISBN: 1-424-40619-6
ISBN: 1-424-40620-X |
| International Conference on Electronics Packaging Technology (ICEPT) <7, 2006, Shanghai> |
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| Englisch |
| Konferenzbeitrag |
| Fraunhofer IZM () |