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New wafer-level-packaging technology using silicon-via-contacts for optical and other sensor applications

: Leib, R.; Töpper, M.

IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Industries Alliance -EIA-; Electronic Components, Assemblies, and Materials Association:
54th Electronic Components & Technology Conference 2004. Proceedings. Vol.1 : Las Vegas, Nevada, USA, June 1 - 4, 2004
Piscataway, NJ: IEEE Service Center, 2004
ISBN: 0-7803-8365-6
ISBN: 0-7803-8366-4
Electronic Components and Technology Conference (ECTC) <54, 2004, Las Vegas/Nev.>
Fraunhofer IZM ()

Wafer-level-packaging has been proven in numerous applications as the optimal packaging solution for microelectronic devices. In the field of sensors and MEMS, packaging cost is still the major expense factor. In this paper, a new packaging technology, which is a combination of wafer-level-packaging (WLP) and MEMS processing technology is presented. With a strong focus on optical applications, the basic processing steps to form a unique wafer-level-package for sensor and MEMS devices is discussed