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Packaging of MEMS structures in SCREAM technology using anodic bonding

 
: Frömel, J.; Wiemer, M.; Gessner, T.

Reichl, H. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Micro System Technologies 2005 : Micro Electro, Opto, Mechanical Systems & Components International Conference & Exhibition, October 5-6, 2005, Munich, Germany
Poing: Franzis, 2005
ISBN: 3-7723-7040-3
S.99-104
International Conference on Micro Electro, Opto, Mechanical Systems & Components <2005, München>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()
Fraunhofer ENAS ()

Abstract
MEMS structures made with the SCREAM (Single Crystal Reactive Etching and Metallization) technology have some typical restrictions. The most important for packaging are: the electrical contacts are trench isolated and the surface is completely covered with metal, usually aluminium, and is even. For packaging on wafer level usually a cover wafer bonded with an intermediate layer for adhesion (e.g. polymer or glass solder) is used. These bonding processes require additional steps for creating the intermediate bonding layer and patterning of this layer. In this paper a wafer level packaging process is presented using anodic bonding for sealing of SCREAM structures, providing a more easy way of encapsulation.

: http://publica.fraunhofer.de/dokumente/N-119262.html