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From Microelectronic Packaging to System Integration

 
: Wolf, M.J.; Reichl, H.

Institute of Electrical and Electronics Engineers -IEEE-:
International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2007 : London, United Kingdom, 15 - 18 April 2007
Piscataway, NJ: IEEE Service Center, 2007
ISBN: 1-4244-1106-8
ISBN: 1-4244-1105-X
ISBN: 978-1-4244-1105-4
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE) <8, 2007, London>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
After a short introduction to fraunhofer IZM the presentation describes system integration characteristics und challanges. It also point out enabling technologies for systems such as Wafer Level Integration and Board Level Integration. Finally the example of the wireless sensor node will be given.

: http://publica.fraunhofer.de/dokumente/N-119229.html