Options
2004
Conference Paper
Titel
A 3D-package technology for fluidic applications based on match-X
Alternative
Eine 3D-Package-Technologie für fluidische Anwendungen basierend auf Match-X
Abstract
The technology will be demonstrated with a miniaturized 3/2-way valve in a 3D-package. With the solder ring technology it is possible to produce fluidic 3D-packages with air tight interfaces. These 3D-packages are air tight up to 8 Bar. Their base material is the PCB material FR4. Other materials like LTCC can be used for high temperature applications. The solder ring technology is based on BGA technology and can also be used in mass production. The modules can be plugged together with interfaces, which are standardized by the Match-X Association. The 3D-package technology can now be transferred to other fluidic applications.