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A 3D-package technology for fluidic applications based on match-X

Eine 3D-Package-Technologie für fluidische Anwendungen basierend auf Match-X
: Schindler-Saefkow, F.; Amiri Jam, K.; Großer, V.; Reichl, H.

Borgmann, H.:
Actuator 2004 : 9th International Conference on New Actuators & 3rd International Exhibition on Smart Actuators and Drive Systems, 14-16 June 2004, Bremen, Germany
Bremen: HVG Hanseatische Veranstaltungs-GmbH Division Messe Bremen, 2004
ISBN: 3-933339-06-5
International Conference on New Actuators <9, 2004, Bremen>
International Exhibition on Smart Actuators and Drive Systems <3, 2004, Bremen>
Fraunhofer IZM ()

The technology will be demonstrated with a miniaturized 3/2-way valve in a 3D-package. With the solder ring technology it is possible to produce fluidic 3D-packages with air tight interfaces. These 3D-packages are air tight up to 8 Bar. Their base material is the PCB material FR4. Other materials like LTCC can be used for high temperature applications. The solder ring technology is based on BGA technology and can also be used in mass production. The modules can be plugged together with interfaces, which are standardized by the Match-X Association. The 3D-package technology can now be transferred to other fluidic applications.