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Verbindungsstruktur und Verfahren zur Herstellung einer Verbindungsstruktur

Connecting structure for connecting electronic component i.e. semiconductor chip, and/or substrate carrier on organic printed circuit board, has contact elements at which material of component or carrier is removed for forming free area
: Reichl, H.; Wolf, J.

Frontpage ()

DE 102008013621 A1: 20080310
DE 102009012643 A: 20090310
Patent, Elektronische Publikation
Fraunhofer ZV, Abteilung Patente und Lizenzen ()

(A1) Die Erfindung betrifft eine Verbindungsstruktur fuer elektronische Bauelemente und/oder Substrattraeger (2) und das Herstellen dieser Verbindungsstruktur. Dabei werden das Bauelement und/oder der Substrattraeger mit Kontaktelementen versehen, die partiell freistehend sind. Das Material um das Kontaktelement wird dabei zumindest teilweise entfernt, um eine zweidimensionale Bewegung des Kontaktelements zu gestatten.


DE 102009012643 A1 UPAB: 20091015 NOVELTY - The structure has column-like contact elements (5) that are provided in an electronic component i.e. organic printed circuit board, and/or substrate carrier (2). The material of the electronic component or substrate carrier is partially removed at the respective contact element such that a free area (6) is formed around the contact element, where the free area provides two-dimensional movement of the contact element. The free area is arranged around the column. The free area surrounds the contact elements in a radially symmetrical manner. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for manufacturing a connecting structure. USE - Connecting structure for connecting an electronic component i.e. semiconductor chip, and/or substrate carrier on a substrate i.e. organic printed circuit board. ADVANTAGE - The free area provides two-dimensional movement of the contact element, so that the different mechanical expansions between the component and/the substrate carrier and the substrate can be balanced, thus improving the electrical-mechanical reliability of the total structure and strongly reducing the critical mechanical voltages at the contact area between the component and/or substrate carrier and the substrate.