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Atmospheric-pressure plasma activation of silicon for MEMS packaging

: Eichler, M.; Michel, B.; Hennecke, P.; Thomas, M.; Klages, C.-P.

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Keudell, A. von:
19th International Symposium on Plasma Chemistry, ISPC 2009. Online Proceedings : Bochum, July 26 to 31, 2009
Online im WWW, 2009
4 S.
International Symposium on Plasma Chemistry (ISPC) <19, 2009, Bochum>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IST ()

Surface treatment by dielectric barrier discharges (DBDs) at atmospheric pressure has been used for the pretreatment of silicon wafers for low temperature direct bonding. The paper presents different plasma techniques based on DBDs and describes the influence of basic plasma parameters. Furthermore results of an innovative method for fracture surface energies measurement performed in-situ during annealing will be discussed.