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Trends in RF & Wireless Packaging

 
: Bock, K.; Wolf, J.; Reichl, H.

Gallium Arsenide Application Symposium Association -GAAS-:
International Conference on Compound Semiconductor Manufacturing Technology 2004. Digest of papers : May 3 - 6, 2004, Sheraton Bal Harbour Beach Resort, Miami Beach, Föorida, USA
St. Louis: GaAS MANTECH, 2004
ISBN: 1-89358-005-9
S.221-224
International Conference on Compound Semiconductor Manufacturing Technology (CS MANTECH) <19, 2004, Miami Beach/Fla.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
!Introduction & Heterointegration !System Integration on Wafer Level !Chip Scale Packaging, 3-D integration, bumping, Integration of Passives, MEMS !System Integration on Board and Flexibel Substrates !Chip in Polymer, High Density (Flex) Interconnect !Polytronic, cost-efficient Systemintegration on Flexible Substrates.

: http://publica.fraunhofer.de/dokumente/N-118576.html