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Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chips

 
: Klein, M.; Hutter, M.; Oppermann, H.; Fritzsch, T.; Engelmann, G.; Dietrich, L.; Wolf, J.; Brämer, B.; Dudek, R.; Reichl, H.

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IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Components, Assemblies, and Materials Association:
58th Electronic Components and Technology Conference 2008. Proceedings. Vol.4 : Lake Buena Vista, FL, 27 - 30 May 2008
Piscataway/NJ: IEEE, 2008
ISBN: 978-1-4244-2230-2
S.1893-1899
Electronic Components and Technology Conference (ECTC) <58, 2008, Lake Buena Vista/Fla.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/N-115309.html