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Hybrid co-packaged receiver module with pin-photodiode chip and DEMUX-IC for 107 Gb/s data rates

 
: Mekonnen, G.G.; Bach, H.-G.; Kunkel, R.; Schubert, C.; Pech, D.; Rosin, T.; Konczykowska, A.; Jorge, F.; Scavennec, A.; Riet, M.

Institute of Electrical and Electronics Engineers -IEEE-:
ECOC 2009, 35th European Conference and Exhibition on Optical Communication. Proceedings : Wien, AT, September 20-24, 2009
Piscataway, NJ: IEEE, 2009
ISBN: 978-1-4244-5096-1
2 S.
European Conference and Exhibition on Optical Communication (ECOC) <35, 2009, Wien>
Englisch
Konferenzbeitrag
Fraunhofer HHI ()

Abstract
A hybrid co-packaged receiver with pin-photodetector and DEMUX-IC for 107 Gb/s is presented. Well opened demultiplexed eye diagrams at 53.5 Gb/s for 107 Gb/s input and error-free demultiplexing performance at PRBS31 were demonstrated.

: http://publica.fraunhofer.de/dokumente/N-113550.html