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Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations

: Jiang, C.; Krozer, V.; Bach, H.-G.; Mekonnen, G.G.; Johansen, T.K.


Institute of Electrical and Electronics Engineers -IEEE-; European Microwave Association:
2009 European Microwave Conference, EuMC 2009. Proceedings : Rome, Italy, 29 September - 1 October 2009. Part of European Microwave Week, EuMW
Piscataway, NJ: IEEE, 2009
ISBN: 978-1-424-44748-0
ISBN: 978-2-87487-011-8
European Microwave Conference (EuMC) <39, 2009, Rome>
European Microwave Week <2009, Rome>
Fraunhofer HHI ()

In this paper we demonstrate ultra-broadband packaging and interconnection designs for photodetector (PD) modules for 100 Gbit/s data transmission applications. The design of packaging and interconnection structures is based on accurate and reliable 3D electromagnetic (EM) simulations. Mode conversion loss due to mode mismatch is identified as the dominant effect of limiting bandwidth of packaged modules. Finally, PD chips are successfully packaged by using wire-bonding technology and conventional coplanar waveguide (CPW) for avoiding mode mismatch. The new packaged PD module demonstrates approximately 100 GHz 3 dB bandwidth.