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Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology - Reliability Investigations and Applications
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2006
Conference Paper
Titel
Super Thin Flip Chip Assemblies on Flex Substrates - Adhesive Bonding and Soldering Technology - Reliability Investigations and Applications
Author(s)
Haberland, J.
Pahl, B.
Kallmayer, C.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
International Symposium on Microelectronics 2006. Proceedings
Konferenz
International Symposium on Microelectronics 2006
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM