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Characterization of plasma damaged porous ULK SiCOH layers in aspect of changes in the diffusion behavior of solvents and repair-chemicals

 
: Oszinda, T.; Schaller, M.; Fischer, D.; Schulz, S.E.

:

Proceedings of the Interconnect Technology Conference, IITC 2009
New York: IEEE, 2009
ISBN: 978-1-4244-4492-2 (print)
ISBN: 978-1-424-44491-5 (online)
S.83-85
International Interconnect Technology Conference (IITC) <2009, Sapporo.>
Englisch
Konferenzbeitrag
Fraunhofer CNT ()

Abstract
The diffusion behavior of different solvents and repair chemicals in a porous SiCOH with pores of similar to 1,5 nm was studied. It was found for molecule with a size <= 1/3 of the pore size the diffusion coefficient (D-e) depends mainly on the size of the molecule, while a size > 1/3 of the pore size does not show a linear dependency of D-e on the molecules size. In this regime D-e is mainly a function of the surface diffusion which depends on the surface energies of the solid and the liquid and adsorption effects. This study show that the porosity and the surface energies influencing the diffusion need to study in order to perform satisfactory cleaning and repair process for ULK dielectric layers.

: http://publica.fraunhofer.de/dokumente/N-113356.html