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The behavior of silicon nitride tools in hot rolling copper wire

: Khader, I.; Fünfschilling, S.; Kailer, A.; Oberacker, R.


Fischer, A. ; Deutsche Gesellschaft für Materialkunde e.V. -DGM-, Oberursel:
Friction, wear and wear protection : International Symposium on Friction, Wear and Wear Protection 2008 Aachen, Germany, from April 9th to 11th, 2008
Weinheim: Wiley-VCH, 2009
ISBN: 978-3-527-32366-1
International Symposium on Friction, Wear and Wear Protection <2008, Aachen>
Fraunhofer IWM ()
ceramic; silicon nitride; copper; rolling; FEM; reaction

The aim of this study is to investigate the behavior of silicon nitride rolls in rolling copper wire. Experimental tests and FE-based simulations were conducted for this purpose. After running the experiments, several inspections were carried out to examine the surfaces of the used specimens. In order to furnish the final conclusions, experimental findings were compared to the outcomes of the simulations. The FE simulations predicted very low thermo-mechanical stresses. Hot rolling experiments showed considerable metallic adhesion on the surface of the ceramic rolls, which was significantly reduced by applying cooling lubricants. Rolling-contact experiments showed moderate wear rates when the proper lubrication was applied. Due to severe selective corrosion of silicon nitride, the same ex periments showed high wear rates when carried out in distilled water. The nature of adhesion between copper and silicon nitride was investigated through reaction experiments. Bulk ceramic materials with different sintering additives as well as synthesized pure secondary phase compositions were tested. Non-wetting behavior was observed between silicon nitride bulk ceramics and copper. The secondary phase samples also showed no significant reaction with copper.