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2009
Conference Paper
Titel
INKtelligent printing of scale comprehensive electrical connections for thermal flow sensors
Alternative
INKtelligent-Drucken umfangreicher elektrischer Verbindungen für thermische Durchflusssensoren
Abstract
New printing technologies of functional structures allow new packaging concepts in order to achieve a high grade of miniaturization for integration of micro electro mechanical systems (MEMS). In this case, a thermal flow sensor, designed and fabricated at IMSAS, has been electrically connected to a printed circuit board by means of INKtelligent printing. We used a maskless aerosol deposition technique for deposition of silver lines with a minimum width of 10 micron. In this way, no bond wires are disturbing the fluid flow within the channel by causing additional turbulences during flow measurement. Due to the possibility to print structures with a resolution down to ten micrometers, the size of bond-pads and therefore the entire sensor size can be reduced.
Author(s)