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Nondestructive testing of damage layers in semiconductor materials by surface acoustic waves

: Schneider, D.; Stiehl, E.; Hammer, R.; Franke, A.; Riegert, R.; Schülke, T.


Starikov, A. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Design, process integration, and characterization for microelectronics : 6 - 7 March 2002, Santa Clara, USA
Bellingham/Wash.: SPIE, 2002 (SPIE Proceedings Series 4692)
ISBN: 0-8194-4439-1
International Symposium on Advanced Microelectronic Manufacturing and Nanotechnologies <2002, Santa Clara/Calif.>
Fraunhofer IWS ()
mechanische Schichtcharakterisierung; Laser-Akustik; Verformung; Festigkeit; Ultraschall

Slicing semi-conductor wafers form ingots produces a damage layer that ha to be completely removed by complex polishing and etching processes. Nondestructively controlling the machining process is desirable. Laser induced surface acoustic waves are demonstrated to be a promising method to characterize the state of the surface.