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Electrostatic wafer handling for thin wafer processing

Elektrostatisches Wafer-Handling zur Prozessierung dünner Wafer
 
: Landesberger, C.; Wieland, R.; Klumpp, A.; Ramm, P.; Drost, A.; Schaber, U.; Bonfert, D.; Bock, K.

International Microelectronics and Packaging Society -IMAPS-, Italian Chapter; Institute of Electrical and Electronics Engineers -IEEE-:
EMPC 2009, 17th European Microelectronics and Packaging Conference & Exhibition. CD-ROM : June 15th-18th, 2009 , Rimini, Italy
New York, NY: IEEE, 2009
ISBN: 0-615-29868-0
ISBN: 978-0-615-29868-9
ISBN: 978-1-4244-4722-0
S.403-407
European Microelectronics and Packaging Conference and Exhibition (EMPC) <17, 2009, Rimini>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
Mobile electrostatic carriers, so called e-carriers, offer a new and promising technical solution for simple and reversible attachment of thin wafers onto support substrates. The paper reports on latest developments in manufacture of e-carriers based on silicon wafers with through substrate vias and backside contact pads. Thermal and electrical characterizations of e-carries have proven very low leakage currents at temperatures up to 300degC. These new types of e-carriers enable long term electrostatic holding capabilities. It is also shown that electrical properties of transistor devices are not changed when CMOS wafers are attached onto e-carriers, neither in face up nor face down attachment configuration. Furthermore, the paper proposes a technical concept how electrostatic support technique can be used for thin wafer processing in wet-chemical environments. E-carriers can also be applied for reversibly bonding of single chip devices onto a carrier substrate. The paper explains how this feature can be used in chip to wafer stacking for 3d integrated systems.

: http://publica.fraunhofer.de/dokumente/N-108902.html