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300mm Wafer Bumping: Printing Systems and Technologies
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2002
Conference Paper
Titel
300mm Wafer Bumping: Printing Systems and Technologies
Author(s)
Töpper, M.
Kloesner, J.
Kasulke, P.
Denise, O.
Myers, J.
Heyen, R.
Hauptwerk
Topical Workshop and Exhibition on Flip Chip Technology 2002. Technical Presentations
Konferenz
Topical Workshop and Exhibition on Flip Chip Technology 2002
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM