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INKtelligent printing of nanoscaled inks for electronic applications

: Wirth, I.; Godlinski, D.; Günther, B.; Werner, C.; Müller, M.; Maiwald, M.; Zöllmer, V.; Busse, M.

Meyer, R. ; Fraunhofer-Allianz Rapid Prototyping:
Euro-uRapid 2007 : International User´s Conference on Rapid Prototyping & Rapid Tooling & Rapid Manufacturing December 3-4, 2007, Frankfurt
Stuttgart: Fraunhofer IRB Verlag, 2008
ISBN: 978-3-8167-7488-4
ISBN: 3-8167-7488-1
International User´s Conference on Rapid Prototyping & Rapid Tooling & Rapid Manufacturing (Euro-uRapid) <2007, Frankfurt>
Fraunhofer IFAM ()
Aerosolabscheidung; elektrischer Leiter; gedruckte Schaltung; komplizierte Form; Nanotechnik; Stereolithographie; Tintendrucker; Wärmebehandlung

'INKtelligent printing' combines the structuring possibilities of inkjet-printing techniques and the aerosol printing technology M3D with the functionality of nanomaterials to generate functional structures like conductors or sensors. This paper addresses digital non-contact printing technologies using metallic nano-particle dispersions as 'inks'. The paper describes the formulation of adequate printable inks from metallic nanopowders, the printing processes, the possibilities of thermal treatment and the functional characterisation of printed electronics. The ability of printing technologies to create complex geometries from a wide range of materials makes them suitable for the production of both passive and active components, including resistors, inductors, capacitors, filters, micro-batteries and antennae. Furthermore, particularly ink-jet printing is scalable and thus may be integrated into existing process lines. Printing conductive paths can be combined with other processes, i. e. thickening via galvanic deposition to achieve conducts that carry higher current. The key to innovative applications is the creation of functionality in printed structures via nanoscale design of materials that would at the same time improve the deposit adhesion during a suitable thermal treatment. The printed functional structures offer a high potential for electronic applications.