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Stress measurement on chip level optimizes packaging and assembly of microsystems

: Schreier-Alt, T.; Schindler-Saefkow, F.; Niehoff, K.; Ansorge, F.; Kittel, H.

MST News (2009), Nr.3, S.24-25
ISSN: 0948-3128
Fraunhofer IZM ()
stress measurement; manufacturing; CMOS; packaging; transfer molding

The iForceSens stress measurement sensor combined with fully parameterized simulations is appropriate to characterize assembly and encapsulation of microelectronic systems. With the derived insights the origin of stresses during manufacturing and quality analysis can be investigated and compared with idealized laboratory experiments and simulations. The methods and insights can be used for the development of stress minimized systems and their assembly. In the future the stress measurement chip can be the basis for an enhanced reliability characterization of micro-electronic systems. By the correlation of stress variations with the progression of failure modes an "on chip structural health monitoring" could be developed.