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Modeling and analysis of return-current paths for microstrip-to-microstrip via transitions

: Ndip, I.; Ohnimus, F.; Guttowski, S.; Reichl, H.


Institute of Electrical and Electronics Engineers -IEEE-:
2nd Electronics Systemintegration Technology Conference, ESTC 2008. Proceedings. Vol.2 : 1st - 4th September 2008, Greenwich, London, UK
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2813-7
ISBN: 978-1-4244-2814-4
ISBN: 1-4244-2813-0
Electronics Systemintegration Technology Conference (ESTC) <2, 2008, London>
Fraunhofer IZM ()

In this contribution, the return-current paths for single-ended microstrip-to-microstrip via transitions in conventional layer stack-ups are modeled and analyzed. Electromagnetic Reliability (EMR) problems which occur in these layer stack-ups, because the return-currents are not properly managed are discussed. Finally, a layer stack-up with well defined return-current paths, which overcomes the limitations of traditional layer stack-ups, is proposed.