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Pb-free conductor gold paste for AlN-ceramic

 
: Hentsche, M.; Kretzschmar, C.; Reppe, G.

Max-Planck-Institut für Chemische Physik fester Stoffe; Fraunhofer-Institut für Fertigungstechnik und Angewandte Materialforschung -IFAM-, Dresden:
APNFM 2008, Advanced processing for novel functional materials : 23-25 January 2008, International Congress Center Dresden, Germany
Dresden, 2008
S.184-191
International Conference Advanced Processing of Novel Functional Materials (APNFM) <2008, Dresden>
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()
aluminium nitride; Au conductor; Pb-free; thick film

Abstract
This work shows the results of the development of a lead-oxide free conductor paste consisting of gold as main electrically conductive component. Gold paste has to be optimized by alloying-elements (Ag, Pd) for improving the wire bondability. Two groups of gold pastes with different alloying elements (Au/Ag and Au/Pd) were prepared and compared. Investigations of resistance, adhesion (Sebastian Pull Test) and surface were use to characterise the sinter behaviour. The results clearly show differences in resistivity, porosity and adhesion between these two groups. Furthermore the wire bondability of the final paste was determined.

: http://publica.fraunhofer.de/dokumente/N-106261.html