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3D image sensor SiP with TSV silicon interposer

 
: Limansyah, I.; Wolf, J.; Klumpp, A.; Zoschke, K.; Wieland, R.; Klein, M.; Oppermann, H.; Nebrich, L.; Heinig, A.; Pechlaner, A.; Reichl, H.; Weber, W.

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Volltext (PDF; )

Institute of Electrical and Electronics Engineers -IEEE-:
IEEE 59th Electronic Components and Technology Conference, ECTC 2009. Vol.3 : San Diego, CA, USA, 26 - 29 May 2009
New York, NY: IEEE, 2009
ISBN: 978-1-4244-4475-5
ISBN: 978-1-4244-4476-2
S.1430-1436
Electronic Components and Technology Conference (ECTC) <59, 2009, San Diego/Calif.>
Englisch
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Abstract
3D system integration is a fast growing field that encompasses different types of technologies. [1] The technology chosen for a specific application will be selected according to the required electrical performance of the systems, the footprint, cost and time to market. Other important factors are the boundary conditions given for the specific components e.g. die size, integration compatibility, component availability (wafer vs. bare die) and testability. The paper discusses a specific 3D image sensor system for automotive applications. The system is based on wafer level technology using silicon interposer with Through Silicon Vias (TSV´s), a flip chip assembled sensor element and a microcontroller. The specific system concept, the technical solution and results are discussed.

: http://publica.fraunhofer.de/dokumente/N-102002.html